- Resource Center Home
- Browse By Category
- Browse By Company
- Agilent Technologies
- Anritsu Corporation
- AR RF/Microwave Instrumentation
- Aries Electronics Inc.
- ASSET® InterTech
- Associated Research, Inc
- Corelis, Inc.
- Cypress Semiconductor Corp.
- Digi International
- DSPCon
- Fanfare
- Finisar
- Fluke Corporation
- Flynn Systems
- Goepel Electronics
- HBM, Inc.
- Honeywell
- IHS, Inc.
- Keithley Instruments
- LeCroy
- LXI Consortium
- Mentor Graphics
- National Instruments
- Pacific Power Source, Inc.
- PCB Load & Torque, Inc.
- Shimadzu
- SyntheSys Research
- Tensilica
- Texas Instruments
- VI Technology
- VTI Instruments
Adjustable Pressure Pad on Aries' New CSP Test Socket
Aries Electronics Inc.
Description
Aries Electronics now offers its 27mm CSP (chip scale package)/MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pads.
Company Overview
Aries Electronics Inc. manufactures a broad range of custom and standard interconnection and packaging products for electronics, including Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-ChipT product line of "intelligent connectors"; and an extensive array of high frequency test and burn in sockets.
Related Resources
Other Resource Centers
RSS Updates
Subscribe to Resource Center updates via RSS:
