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New CSP Test Socket for Smaller Devices Up to 13 mm Squared Join Aries' Family of Sockets Featuring Adjustable Pressure Pad
Aries Electronics Inc.
Description
Aries has expanded its line of CSP (chip scale package)/MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pad to include a persion that accommodates devices 13 mm squared or smaller, with a pitch of 0.30 mm or higher.
Company Overview
Aries Electronics Inc. manufactures a broad range of custom and standard interconnection and packaging products for electronics, including Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-ChipT product line of "intelligent connectors"; and an extensive array of high frequency test and burn in sockets.
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