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Aries Electronics Inc.
Aries Electronics Inc. manufactures a broad range of custom and standard interconnection and packaging products for electronics, including Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-ChipT product line of "intelligent connectors"; and an extensive array of high frequency test and burn in sockets.
Application Note: Aries has designed a complete, new, cost effective concept for test sockets. The design is very cost effective for two reasons... more
Product Literature: A conversation between Aries Electronics and a customer explaining the evolutions of a test socket... more
White Paper: The Conundrum: The way to get the piece cost down on a test socket designed to work with a specific device package is to make a set of molds specific to the application. Unfortunately, a set of molds is expensive. If you’re going to make thousands of sockets, you can justify this cost. But for... more
Aries’ New Fine Pitch Bump Adapters Adapt BGA Devices of Any Pitch to 0.40 mm Pitch Boards
Aries Electronics Inc.
Data Sheet: Aries Electronics' expanded line of Pine Pitch Bump Adapters include adapters that accommodate boards with pitches down to 0.40 mm. As part of the Correct-A-Chip series, the Fine Pitch Bump Adapters allow customers to use higher pitch devices on smaller pitch boards... more
New BGA Switch-A-Pitch Adapters from Aries Now Adapt 0.50 mm Devices to 1.00 mm Boards
Aries Electronics Inc.
Data Sheet: Aries recently added new BGA Switch-A-Pitch Adapters that adapt to pitch bottoms lower than previous models, expanding this unique product line that economically facilitates the use of smaller pitch devices with larger pitch boards... more
New CSP Test Socket for Smaller Devices Up to 13 mm Squared Join Aries' Family of Sockets Featuring Adjustable Pressure Pad
Aries Electronics Inc.
Data Sheet: Aries has expanded its line of CSP (chip scale package)/MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pad to include a persion that accommodates devices 13 mm squared or smaller, with a pitch of 0.30 mm or higher... more
Data Sheet: Aries Electronics now offers its 27mm CSP (chip scale package)/MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pads... more
Data Sheet: Aries Electronics expanded its line of BGA Switch-A-Pitch Adapters that simplify high density interconnect (HDI) construction to enable the use of smaller pitch devices on larger pitch boards. The series now includes models with tops where the BGA landing pads are on a 0.40 mm pitch and adapter... more
Product Literature: Aries Electronics now offers a new high-frequency center probe test socket comprised of a standard molded format that enables the socket to accommodate any device 6.5 mm or smaller. Aries’ versatile center probe test socket is suitable for use with test and dynamic burn-in of CSP, MicroBGA, DSP... more
Application Note: In the late 1980’s, Aries introduced the concept of “Correct-A-Chip Adapters”. The initial designs resulted from applications where a through-hole DIP device became obsolete. Aries innovated the use of PCBs integrated into DIP to DIP adapters where the female pins on the top of the adapter were... more
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